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Conductive Brush Ring overcomes current leakage in EV powertrains

SKF's new Conductive Brush Ring paves the way to greater reliability and longer life in high-performance electric vehicle powertrain systems. Using pure carbon fiber bristles, it provides a reliable electrical connection between an EV eAxle rotor shaft and its housing. When used in combination with SKF Hybrid ceramic ball bearings, it helps to alleviate parasitic current effects that can lead to premature failure in bearings and other components. Available in different configurations for wet (oil-lubricated) motor designs -- and soon for dry (sealed) applications.
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Intro to reed switches, magnets, magnetic fields

This brief introductory video on the DigiKey site offers tips for engineers designing with reed switches. Dr. Stephen Day, Ph.D. from Coto Technology gives a solid overview on reed switches -- complete with real-world application examples -- and a detailed explanation of how they react to magnetic fields.
View the video.

Bi-color LEDs to light up your designs

Created with engineers and OEMs in mind, SpectraBright Series SMD RGB and Bi-Color LEDs from Visual Communi-cations Company (VCC) deliver efficiency, design flexibility, and control for devices in a range of industries, including mil-aero, automated guided vehicles, EV charging stations, industrial, telecom, IoT/smart home, and medical. These 50,000-hr bi-color and RGB options save money and space on the HMI, communicating two or three operating modes in a single component.
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All about slip rings: How they work and their uses

Rotary Systems has put together a really nice basic primer on slip rings -- electrical collectors that carry a current from a stationary wire into a rotating device. Common uses are for power, proximity switches, strain gauges, video, and Ethernet signal transmission. This introduction also covers how to specify, assembly types, and interface requirements. Rotary Systems also manufactures rotary unions for fluid applications.
Read the overview.

Seifert thermoelectric coolers from AutomationDirect

Automation-Direct has added new high-quality and efficient stainless steel Seifert 340 BTU/H thermoelectric coolers with 120-V and 230-V power options. Thermoelectric coolers from Seifert use the Peltier Effect to create a temperature difference between the internal and ambient heat sinks, making internal air cooler while dissipating heat into the external environment. Fans assist the convective heat transfer from the heat sinks, which are optimized for maximum flow.
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EMI shielding honeycomb air vent panel design

Learn from the engineering experts at Parker how honeycomb air vent panels are used to help cool electronics with airflow while maintaining electromagnetic interference (EMI) shielding. Topics include: design features, cell size and thickness, platings and coatings, and a stacked design called OMNI CELL construction. These vents can be incorporated into enclosures where EMI radiation and susceptibility is a concern or where heat dissipation is necessary. Lots of good info.
Read the Parker blog.

What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
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Loss-free conversion of 3D/CAD data

CT CoreTech-nologie has further developed its state-of-the-art CAD converter 3D_Evolution and is now introducing native interfaces for reading Solidedge and writing Nx and Solidworks files. It supports a wide range of formats such as Catia, Nx, Creo, Solidworks, Solidedge, Inventor, Step, and Jt, facilitating smooth interoperability between different systems and collaboration for engineers and designers in development environments with different CAD systems.
Learn more.

Top 5 reasons for solder joint failure

Solder joint reliability is often a pain point in the design of an electronic system. According to Tyler Ferris at ANSYS, a wide variety of factors affect joint reliability, and any one of them can drastically reduce joint lifetime. Properly identifying and mitigating potential causes during the design and manufacturing process can prevent costly and difficult-to-solve problems later in a product lifecycle.
Read this informative ANSYS blog.

Advanced overtemp detection for EV battery packs

Littelfuse has introduced TTape, a ground-breaking over-temperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems monitor and manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. This solution is ideally suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and energy storage systems.
Learn more.

Benchtop ionizer for hands-free static elimination

EXAIR's Varistat Benchtop Ionizer is the latest solution for neutralizing static on charged surfaces in industrial settings. Using ionizing technology, the Varistat provides a hands-free solution that requires no compressed air. Easily mounted on benchtops or machines, it is manually adjustable and perfect for processes needing comprehensive coverage such as part assembly, web cleaning, printing, and more.
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LED light bars from AutomationDirect

Automation-Direct adds CCEA TRACK-ALPHA-PRO series LED light bars to expand their offering of industrial LED fixtures. Their rugged industrial-grade anodized aluminum construction makes TRACKALPHA-PRO ideal for use with medium to large-size industrial machine tools and for use in wet environments. These 120 VAC-rated, high-power LED lights provide intense, uniform lighting, with up to a 4,600-lumen output (100 lumens per watt). They come with a standard bracket mount that allows for angle adjustments. Optional TACLIP mounts (sold separately) provide for extra sturdy, vibration-resistant installations.
Learn more.

World's first metalens fisheye camera

2Pi Optics has begun commercial-ization of the first fisheye camera based on the company's proprietary metalens technology -- a breakthrough for electronics design engineers and product managers striving to miniaturize the tiny digital cameras used in advanced driver-assistance systems (ADAS), AR/VR, UAVs, robotics, and other industrial applications. This camera can operate at different wavelengths -- from visible, to near IR, to longer IR -- and is claimed to "outperform conventional refractive, wide-FOV optics in all areas: size, weight, performance, and cost."
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Orbex offers two fiber optic rotary joint solutions

Orbex Group announces its 700 Series of fiber optic rotary joint (FORJ) assemblies, supporting either single or multi-mode operation ideal for high-speed digital transmission over long distances. Wavelengths available are 1,310 or 1,550 nm. Applications include marine cable reels, wind turbines, robotics, and high-def video transmission. Both options feature an outer diameter of 7 mm for installation in tight spaces. Construction includes a stainless steel housing.
Learn more.

Mini tunnel magneto-resistance effect sensors

Littelfuse has released its highly anticipated 54100 and 54140 mini Tunnel Magneto-Resistance (TMR) effect sensors, offering unmatched sensitivity and power efficiency. The key differentiator is their remarkable sensitivity and 100x improvement in power efficiency compared to Hall Effect sensors. They are well suited for applications in position and limit sensing, RPM measurement, brushless DC motor commutation, and more in various markets including appliances, home and building automation, and the industrial sectors.
Learn more.

New chip designed to provide greatest precision in memory to date

A new chip designed by researchers at the University of Southern California will enable powerful AI in your portable devices. [Credit: Joshua Yang of USC and TetraMem]

 

 

Everyone is talking about the newest artificial intelligence (AI) and the power of neural networks, forgetting that software is limited by the hardware on which it runs. However, it is hardware, says University of Southern California (USC) Professor of Electrical and Computer Engineering Joshua Yang, that has become "the bottleneck."

Now, Yang's new research with collaborators might change that. They believe that they have developed a new type of chip with the best memory of any chip thus far for edge AI (AI in portable devices).

For approximately the past 30 years, while the size of the neural networks needed for AI and data science applications doubled every 3.5 months, the hardware capability needed to process them doubled only every 3.5 years. According to Yang, hardware presents a more and more severe problem for which few have patience.

Governments, industry, and academia are trying to address this hardware challenge worldwide. Some continue to work on hardware solutions with silicon chips, while others are experimenting with new types of materials and devices. Yang's work falls into the middle, focusing on exploiting and combining the advantages of the new materials and traditional silicon technology that could support heavy AI and data science computation.

The researchers' new paper in Nature focuses on the understanding of fundamental physics that leads to a drastic increase in memory capacity needed for AI hardware. The team, led by Yang, with researchers from USC (including Han Wang's group), MIT, and the University of Massachusetts, developed a protocol for devices to reduce "noise" and demonstrated the practicality of using this protocol in integrated chips. This demonstration was made at TetraMem, a startup company co-founded by Yang and his co-authors (Miao Hu, Qiangfei Xia, and Glenn Ge) to commercialize AI acceleration technology.

According to Yang, this new memory chip has the highest information density per device (11 bits) among all types of known memory technologies thus far. Such small but powerful devices could play a critical role in bringing incredible power to the devices in our pockets. The chips are not just for memory but also for the processor -- and millions of them in a small chip, working in parallel to rapidly run your AI tasks, could only require a small battery for power.

The chips that Yang and his colleagues are creating combine silicon with metal oxide memristors in order to create powerful but low-energy-intensive chips. The technique focuses on using the positions of atoms to represent information rather than the number of electrons (which is the current technique involved in computations on chips).

The positions of the atoms offer a compact and stable way to store more information in an analog, instead of a digital, fashion. Moreover, the information can be processed where it is stored instead of being sent to one of the few dedicated "processors," eliminating the so-called "von Neumann bottleneck" existing in current computing systems. In this way, says Yang, computing for AI is "more energy efficient with a higher throughput."

How it works
Yang explains that electrons that are manipulated in traditional chips are "light." This lightness makes them prone to moving around and being more volatile. Instead of storing memory through electrons, Yang and collaborators are storing memory in full atoms.

Here is why this memory matters. Normally, says Yang, when one turns off a computer, the information memory is gone -- but if you need that memory to run a new computation and your computer needs the information all over again, you have lost both time and energy. This new method, focusing on activating atoms rather than electrons, does not require battery power to maintain stored information. Similar scenarios happen in AI computations, where a stable memory capable of high information density is crucial. Yang imagines this new tech that may enable powerful AI capability in edge devices, such as Google Glasses, which he says previously suffered from a frequent recharging issue.

Further, by converting chips to rely on atoms as opposed to electrons, chips become smaller. Yang adds that with this new method, there is more computing capacity at a smaller scale, and this method, he says, could offer "many more levels of memory to help increase information density."

To put it in context, right now, ChatGPT is running on a cloud. The new innovation, followed by some further development, could put the power of a mini version of ChatGPT in everyone's personal device. It could make such high-powered tech more affordable and accessible for all sorts of applications.

Read "Thousands of conductance levels in memristors integrated on CMOS" in Nature.

Source: University of Southern California

Published April 2023

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